LEDMAN is a global LED display manufacturer and a pioneer in Chip-on-Board (COB) LED technology, developing advanced ultra-fine-pitch display solutions for professional visualization applications.
From corporate boardrooms and higher education to broadcast studios, control rooms and premium visualization environments, LEDMAN COB displays combine exceptional image quality with the durability, efficiency and reliability of next-generation COB technology.
As the exclusive Canadian distributor for LEDMAN COB LED technology, APG Displays provides AV dealers and integrators with local access to LEDMAN products backed by system design assistance, technical support, demonstration facilities, installation and after-sales service.
Chip-on-Board (COB) represents an important advancement in direct-view LED display technology. By integrating LED chips directly onto the display module and protecting them within a durable surface, COB enables extremely fine pixel pitches while delivering outstanding image quality, reliability and efficiency.
Pixel pitches below 1mm deliver exceptional image detail for close-viewing applications where resolution and visual clarity are critical.
Advanced COB construction delivers deep blacks, high contrast and impressive image performance across premium visualization environments.
The integrated COB surface helps protect the LED components from impact, dust and handling, creating a more robust display surface.
Efficient LED architecture and thermal management can help reduce power consumption and heat generation in professional display applications.
LEDMAN offers both Real Pixel and Pixel Sharing Engine (PSE) COB technologies, giving AV integrators greater flexibility when selecting an ultra-fine-pitch LED solution for their customers.
At the APG Displays LEDMAN Demo Center, both technologies can be experienced and compared side by side. Dealers and integrators can even test their customer's own content across different LED technologies and pixel pitches before specifying a system.
LEDMAN offers advanced COB LED solutions for corporate, education, broadcast, control room and premium visualization applications — including ultra-fine-pitch Real Pixel and PSE displays and integrated All-in-One LED systems.
Exceptional image detail, contrast and durability for close-viewing applications where image quality matters most. Available in 0.7mm, 0.9mm and 1.2mm pixel pitches.
163" / 135" / 108"
Integrated all-in-one LED displays combining the screen, processing and control into one streamlined system — ideal for boardrooms, higher education, auditoriums and presentation spaces.
LEDMAN offers advanced COB LED solutions for corporate, education, broadcast, control room and premium visualization applications — including ultra-fine-pitch Real Pixel and PSE displays and integrated All-in-One LED systems.
Exceptional image detail, contrast and durability for close-viewing applications where image quality matters most. Available in 0.7mm, 0.9mm and 1.2mm pixel pitches.
163" / 135" / 108"
Integrated all-in-one LED displays combining the screen, processing and control into one streamlined system — ideal for boardrooms, higher education, auditoriums and presentation spaces.
New Canadian showroom gives AV integrators and dealers hands-on access to LEDMAN COB displays, including 0.7mm, 0.9mm and 1.2mm pixel pitches, Pixel Sharing Engine technology and All-in-One LED solutions.
OAKVILLE, ONTARIO – October 2026 – APG Displays, the professional AV distribution division of APG Technology Group, is pleased to announce the opening of its new LEDMAN COB LED Demo Center at its Canadian headquarters in Oakville, Ontario.
LAS VEGAS, NEVADA – June 2026 – APG Displays, the AV Distribution division of APG Technology Group, is proud to announce a new exclusive distribution agreement with LEDMAN, a global leader in advanced LED display technology and a pioneer in Chip-on-Board (COB) LED displays.
ORLANDO, FL — 5th May 2026 — APG Displays is pleased to invite clients, partners, and industry professionals to its Orlando Open House, taking place June 25th & 26th at the company’s Orlando facility.